Introduction
Note: this post will be updated. As such it shall be considered work in progress. A change log is shown at the end.
Last change 2025.01.01 (yyyy.mm.dd)
The Sensing PCB is considered priority 0, being 0 the highest priority.
As such, at this stage it is important to record constraints that would affect specifications of other components.
Constraints
- Conductive specifications, impacting the change of capacitance of the Sensing PCB and therefore the sensing of the controller.
- Compatibility with IBM model M boards to ensure easy FSSK/FEXT-like projects
Alternatives currently considered
- Injection molding - under investigation
- Filament 3D printed
- conductive material
- 3d printed part with conductive paint
- 3d printed part with coating (graphite)
- Resin 3D printed
- Epoxy with a percentage of graphite
--- change log (yyyy.mm.dd) ---
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The following spoiler section contains the first message of the original thread which was named "give and take: 3D printed model F flippers (closed in favor of FSF component)". I had to use this first post as introduction and I did not want to delete it
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